Total Solution for Semiconductor IC Test Socket, Spring Contact Probe, Wafer Probe Card, ATE Load Board, Burn-in Socket and High Density Coaxial Connector
Semiconductor Test Socket Elastomeric sockets ATE Load Board Wafer Probe Card Spring Contact Probe Test Socket Lid Custom Support Plate Burn-in Socket Hight Density Coaxial Connector Application Engineering Free Custom Design Technical Support Local Stocking of Inventory Supports JIT Manufacturing Quality Standard Set-up
Our Commitment
Product Excellence In-depth Application Consulting Intelligent Design Engineering Precision Manufacturing Stringent Quality Control Two-week Goal for ; - Design Completion - Prototype Delivery - Mass Production Delivery No NRE Charge No Tooling Charge Flexible Approach Goal Oriented Customer Care Benefits for You
Highest Quality Product Best Test Yield Shortest Lead Time Shortest Time-to-Market Competitive Price Intensive Local Support One Stop Total Solution
Qualmax provides best quality ATE Load Board (DUT Board) for Semiconductor Test
Qualmax would like to be a single reliable source for all your IC test needs including ATE Load Board. We understand all aspects of the load board design and fabrication and its dynamics to the test socket and the ATE test head. All design engineering is performed in the United States in close contact with the customers, which enables the fastest design turn around time. Then, the boards are manufactured and thoroughly tested by our ISO 9001 certified strategic partner in Korea, which has advanced equipment and production engineering experience of decades. The most stringent quality control standards are implemented to guarantee the highest level of test yield.
ATE Load Board fabrication demands advanced technology with micron level of pattern routing, micro hole drilling, plating and impedance control. Qualmax offers ATE load boards (socket boards) for most of the popular ATE models, including;
Delivery :Within 10 days after the drawing approval
Specifications :
Material: FR-4, FR-4(hi-tg), Polyimide, PPE, BT and etc. Layer Count: Upto 64 layers Min drilled hole dia.: 0.35mm Min Thickness: 0.2mm Max Thickness: 7.0mm Thickness Tolerance: 0.150mm Min pad pitch: 0.4mm Aspect Ratio: upto 21:1 Impedance : 33 Ohms, 50 Ohms, 75 Ohms, 90 Ohms Impedance Control: +/- 5% or +/- 10%
Services: Board Design, Board Fabrication and Test, Board Assembly and Test.
RF, Mixed Signal and High Speed PCBs
Product Examples
Fabrication and Quality Control Equipment
Laser Plotter Micro Etching Line Exposer DES Line AOI Oxide Line Layer-up Hot Press x-ray Inspection High speed drilling machine Plasma desmear system Automated plating line Au plating line Depaneling machine
